Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates
OwnerSalman Akraminventor
Life of this patent
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Abstract
One or more of stabilizers are formed or disposed on the surface of a semiconductor device or test substrate prior to orienting the semiconductor device so that a contact-bearing surface thereof faces the test substrate. Upon assembly of the semiconductor device and test substrate, the stabilizers prevent the semiconductor device from tipping or tilting relative to the test substrate. The stabilizers may be formed by selectively consolidating material under control of a program. The one or more stabilizers may be formed following the “recognition” of one or more features of the component on which they are to be fabricated.
Claims25
A method for fabricating a semiconductor device component to facilitate orientation of a semiconductor device adjacent to a test substrate with an active surface of the semiconductor device facing the test substrate, the method comprising:
- providing at least one semiconductor device component including contacts;
- and
- selectively consolidating material under control of a program to form at least one stabilizer on a surface of the at least one semiconductor device component in a location sufficient to at least partially temporarily stabilize an orientation of the semiconductor device component upon assembly with the test substrate.
A method for fabricating a semiconductor device component, comprising:
- placing at least one of at least one semiconductor device component and at least one test substrate in a horizontal plane;
- recognizing a location and orientation of at least one feature of the at least one semiconductor device component or the at least one test substrate;
- fabricating at least one stabilizer comprising at least one region of semisolid material on a surface of the at least one semiconductor device component or the at least one test substrate by a programmed material consolidation process and at a location based on a recognized location and orientation of the at least one feature, the at least one stabilizer being configured to at least partially stabilize an orientation of at least one semiconductor device component upon disposal thereof face-down on a test substrate.
Dependencies are inferred from the claim text.