Photosensitive resin composition and method of forming a pattern using the composition
OwnerHiroki Maedainventor
Life of this patent
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Abstract
A photosensitive resin composition comprises a multi-functional epoxy resin and a cation polymerization initiator represented by general formula (1) shown below: (in the formura (1), X1 and X2 indicate a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond, and they may be identical to or different from one another. Y indicates a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond). The photosensitive resin composition is used as a pattern formation composition.
Claims10
1-8. (canceled)
A photosensitive resin composition comprising:
- a multi-functional bisphenol A novolak epoxy resin, a functionality of which is 5-functional groups or more and represented by general formula (3) shown below:
- (in the formula, R1 to R6 are independently H or CH3, respectively, n indicates zero or larger integer);
- and
- a cation polymerization initiator represented by general formula (1) shown below:
- (in the formula, X1 and X2 indicate a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond, respectively, and they may be identical to or different from one another, and Y indicates a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom, or an alkoxy group to which a substituent may bond).
A photosensitive resin composition laminate comprising:
- a photosensitive resin composition layer obtained from the photosensitive resin composition according to clam 9;
- and
- a protective film,
- wherein at least one side of the photosensitive resin composition layer is protected with the protective film.
Dependencies are inferred from the claim text.