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US 2006/0188727 A1Published application
Thermally conductive resin sheet and power module using the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHiromi Ito, Osamu Yashiro
Life of this patent
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Abstract
A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler. The ratio of the volume content, VL, of the flat inorganic filler to volume content, VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.
Claims7
A thermally conductive resin sheet comprising:
- a thermosetting resin;
- and
- a thermally conductive and electrically insulating inorganic filler, wherein
- the inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler, and
- ratio of volume content, VL, of the flat inorganic filler to volume content, VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.
2 more elements
A power module comprising:
- a lead frame;
- a power semiconductor device on a first surface of the lead frame;
- a cured material of a thermally conductive resin sheet on a second surface, opposite the first surface of the lead frame on which the power semiconductor device is located;
- and
- a heat sink member in intimate contact with the cured material, wherein
- the thermally conductive resin sheet includes a thermosetting resins and a thermally conductive and electrically insulating inorganic filler,
- the inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler, and
- ratio of volume content, VL, of the flat inorganic filler to volume contents VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.
5 more elements
A power module comprising:
- a lead frame;
- a power semiconductor device on a first surface of the lead frame;
- and
- a cured material of a thermally conductive resin sheet, as a heat sink member, on a second surface, opposite to the first surface of the lead frame on which the power semiconductor device is located, wherein
- the thermally conductive resin sheet includes a thermosetting resin and a thermally conductive and electrically insulating inorganic filler,
- the inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler, and
- ratio of volume content, VL, of the flat inorganic filler to volume contents VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20 in terms of VL/VR.
4 more elements
A power module comprising:
- a heat sink member;
- a circuit board on a surface of the heat sink member;
- a power semiconductor device on the circuit board;
- a case bonded to a periphery of the heat sink member;
- a casting resin within the case, sealing the circuit board and the power semiconductor device;
- a cured material of a thermally conductive resin sheet laminated on a surface, opposite the surface of the heat sink member on which the circuit board is located;
- and
- a heat spreader joined to the heat sink member via the cured material of the thermally conductive resin sheet, wherein
- the thermally conductive resin sheet includes a thermosetting resin and a thermally conductive and insulating inorganic filler,
- the inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler, and
- ratio of volume content, VL, of the flat inorganic filler to volume contents VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20 in terms of VL/VR.
8 more elements
Dependencies are inferred from the claim text.