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US 2006/0188706 A1Published application
Thermally activatable removable adhesive tapes
OwnerMitsuaki Kobayashi, Eiji Mizuno +1inventors
InventorsMitsuaki Kobayashi, Eiji Mizuno, Aizo Sakurai
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Abstract
The present invention provides adhesive tapes that can be firmly bonded to a bonded article at a temperature below an activation temperature and cannot be easily peeled and removed, but can be easily peeled without substantially leaving adhesive residue on the bonded article and without damaging the bonded article at a temperature exceeding the activation temperature.
Claims21
An adhesive tape comprising:
- a film substrate having one or more individual layers, wherein the film substrate has (i) an elastic modulus of at least 7.0×108 Pa at a temperature below an activation temperature, said activation temperature ranging from about 25° C. to about 100° C., (ii) an elastic modulus of not greater than 5.0×108 Pa at a temperature exceeding said activation temperature, and (iii) an elongation at break of at least 150% at a temperature exceeding said activation temperature;
- an adhesive layer disposed on at least one surface of the film substrate;
- and
- a temperature-indicating material disposed within or on the film substrate, wherein the temperature-indicating material experiences a color change when exposed to a color-changing temperature.
1 more element
(canceled)
An adhesive tape comprising:
- a film substrate having (i) an elastic modulus of at least 7.0×108 Pa at a temperature below an activation temperature, said activation temperature ranging from about 25° C. to about 100° C., (ii) an elastic modulus of not greater than 5.0×108 Pa at a temperature exceeding said activation temperature, and (iii) an elongation at break of at least 150% at a temperature exceeding said activation temperature, said film substrate comprising an aliphatic polyester, polyvinyl chloride, polycarbonate, polycaprolactone, polyethylene terephthalate resin, glycol modified polyethylene terephthalate resin, polybutylene terephthalate resin, polyamide resin, polyvinylidene fluoride, one or more shape memory resins, or a combination thereof;
- and
- a first adhesive layer disposed on at least one surface of said film substrate.
(canceled)
16-17. (canceled)
(canceled)
A method of removing an adhesive tape from a bonded article, said method comprising the steps of:
- heating the adhesive tape to a temperature greater than an activation temperature, said activation temperature ranging from about 25° C. to about 100° C., said adhesive tape comprising a film substrate having (i) an elastic modulus of at least 7.0×108 Pa at a temperature below the activation temperature, (ii) an elastic modulus of not greater than 5.0×108 Pa at a temperature exceeding the activation temperature, and (iii) an elongation at break of at least 150% at a temperature exceeding the activation temperature;
- said adhesive tape further comprising a temperature-indicating material disposed within or on a film substrate wherein the temperature-indicating material experiences a color change when exposed to a temperature above the activation temperature, said method further comprising the step of:
- monitoring the temperature-indicating material;
- and
- if the temperature-indicating material changes color, pulling the adhesive tape from the bonded article at an angle of up to 35° relative to a bonded surface on the bonded article.
2 more elements
(canceled)
Dependencies are inferred from the claim text.