Method and apparatus for determining an improved assist feature configuration in a mask layout

A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for determining an assist feature configuration which specifies locations and dimensions for one or more assist features in a mask layout, the method comprising:

• receiving a mask layout;
• creating a set of candidate assist feature configurations;
• and
• determining an improved assist feature configuration using the set of candidate assist feature configurations and a process-sensitivity model which can be represented by a multidimensional function that captures process-sensitivity information;
• wherein placing assist features in the mask layout based on the improved assist feature configuration improves the manufacturability of the mask layout;
• wherein using the process-sensitivity model to determine the improved assist feature configuration reduces the computational time required to determine the improved assist feature configuration in the mask layout.

A method for determining assist feature dimensions for one or more assist features located in a 2-D region in a mask layout, the method comprising:

• receiving a set of assist features located in a 2-D region in a mask layout;
• creating a set of candidate assist feature configurations, wherein an assist feature configuration specifies dimensions for one or more assist features;
• and
• determining an improved assist feature configuration using the set of candidate assist feature configurations and a process model that models one or more semiconductor manufacturing processes;
• wherein dimensioning assist features in the mask layout based on the improved assist feature configuration improves the manufacturability of the 2-D region in the mask layout.

A computer-readable storage medium storing instructions that when executed cause the computer to perform a method for determining assist feature dimensions for one or more assist features located in a 2-D region in a mask layout, the method comprising:

• receiving a set of assist features located in a 2-D region in a mask layout;
• creating a set of candidate assist feature configurations, wherein an assist feature configuration specifies dimensions for one or more assist features;
• and
• determining an improved assist feature configuration using the set of candidate assist feature configurations and a process model that models one or more semiconductor manufacturing processes;
• wherein dimensioning assist features in the mask layout based on the improved assist feature configuration improves the manufacturability of the 2-D region in the mask layout.