Method of forming inorganic orientation film, inorganic orientation film, substrate for electronic devices, liquid crystal panel, and electronic equipment
AssigneeSeiko Epson Corporation
InventorHidenobu Ota
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AssigneeSeiko Epson Corporation
InventorHidenobu Ota
Estimating the term…
In a method of forming an inorganic orientation film, a target is irradiated with ion beams supplied from an ion beam source to lead out sputter particles from the target, and then the sputter particles are made incident on a matrix to form the inorganic orientation film, wherein the film formation is carried out without replacing the whole of the target while carrying out a repair processing for supplementing or recovering a defect of the target. The target is formed from a plurality of separable members so that only a part of the separable members can be selected and replaced, and the repair processing is carried out by replacing a member within the plural separable members on which the defect is produced. According to this method, it is possible to manufacture an inorganic orientation film which is excellent in an orientation characteristic and also excellent in light resistance while effectively using the target. This saves resources and gives fewer burdens on an environment. Further, an inorganic orientation film obtained by the forming method, and a substrate for electronic devices provided with the inorganic orientation film are also provided. Furthermore, a liquid crystal panel provided with the in organic orientation film, and electronic equipment provided with the liquid crystal panel are also provided.
A method of forming an inorganic orientation film, in which a target is irradiated with ion beams supplied from an ion beam source to lead out sputter particles from the target, and then the sputter particles are made incident on a matrix to form the inorganic orientation film,
Dependencies are inferred from the claim text.