Multi-chip module and method for mounting thereof
AssigneeFuji Xerox Co., Ltd.
InventorNaoshi Kotake
Life of this patent
Estimating the term…
Abstract
A multi-chip module having an optical element sending and receiving optical signals and mounted on a printed circuit board in which an optical guide is formed, includes an optical path-converting member that protrudes from a face of the multi-chip module that is to be connected to the printed circuit board, is optically connected to the optical element, and is inserted into an inserting hole formed on the printed circuit board so as to intersect the optical guide when mounting the multi-chip module. The optical path-converting member is inserted into the inserting hole to form an optical path guiding light from the optical element into the optical guide or guiding light transmitted through the optical guide into the optical element.
Claims5
A multi-chip module that comprises an optical element sending and receiving optical signals and is mounted on a printed circuit board in which an optical guide is formed, the multi-chip module comprising:
- an optical path-converting member that protrudes from a face of the multi-chip module that is to be connected to the printed circuit board, optically connected to the optical element, and inserted into an inserting hole formed on the printed circuit board so as to intersect the optical guide when mounting the multi-chip module,
- the optical path-converting member being inserted into the inserting hole to form an optical path guiding light from the optical element into the optical guide or guiding light transmitted through the optical guide into the optical element.
A multi-chip module that comprises an optical element sending and receiving optical signals and is mounted on a printed circuit board in which an optical guide is formed, the multi-chip module comprising:
- an inserting block that is formed on a face of the multi-chip module that is to be connected to the printed circuit board and is inserted into an inserting hole on the printed circuit board so as to intersect the optical guide when mounting the multi-chip module,
- the optical element being disposed on a side face of the inserting block so as to face an end face of the optical guide in the inserting hole when mounting the multi-chip module.
A method for mounting a multi-chip module that comprises an optical element sending and receiving optical signals on a printed circuit board having an optical guide formed thereon comprising:
- forming an inserting hole on the printed circuit board so as to intersect the optical guide;
- and
- connecting one end of an optical path-converting member to the optical element of the multi-chip module and inserting the other end thereof to the inserting hole formed on the printed circuit board to form an optical path guiding light from the optical element into the optical guide or guiding light transmitted in the optical guide to the optical element.
Dependencies are inferred from the claim text.