Semiconductor package, ID generating system thereof, ID recognizing system thereof, ID recognition method thereof, semiconductor integrated circuit chip, ID generating system thereof, ID recognizing system thereof, and ID recognition method thereof

A semiconductor integrated circuit chip ID generating system, comprising:

• a function of selecting a topographic characteristic to be utilized as specific information from at least one topographic characteristic that a semiconductor integrated circuit chip has;
• a function of measuring the selected topographic characteristic as the specific information;
• and
• a function of generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information.

A semiconductor package ID recognizing system, comprising:

• a function of selecting a topographic characteristic to be utilized as specific information from at least one topographic characteristic that a semiconductor package has;
• a function of measuring the selected topographic characteristic as the specific information;
• a function of generating an ID for identification for the semiconductor package based on the measured specific information;
• a function of storing the generated ID for identification into a database;
• and
• a function of acquiring again the ID for identification of the semiconductor package by re-measuring the selected topographic characteristic as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor integrated circuit chip ID recognizing system, comprising:

• a function of selecting a topographic characteristic to be utilized as specific information from at least one topographic characteristic that a semiconductor integrated circuit chip has;
• a function of measuring the selected topographic characteristic as the specific information;
• a function of generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information;
• a function of storing the generated ID for identification into a database;
• and
• a function of acquiring again the ID for identification of the semiconductor integrated circuit by re-measuring the selected topographic characteristic as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor package ID recognition method, comprising the steps of:

• selecting a topographic characteristic to be utilized as specific information from at least one topographic characteristic that a semiconductor package has;
• measuring the selected topographic characteristic as the specific information;
• generating an ID for identification for the semiconductor package based on the measured specific information;
• storing the generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor package by re-measuring the selected topographic characteristic as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor integrated circuit chip ID recognition method, comprising the steps of:

• selecting a topographic characteristic to be utilized as specific information from at least one topographic characteristic that a semiconductor integrated circuit chip has;
• measuring the selected topographic characteristic as the specific information;
• generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information;
• storing the generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor integrated circuit chip by re-measuring the selected topographic characteristic as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor package ID recognition method, comprising the steps of:

• measuring roughness of a surface of a semiconductor package as specific information;
• generating an ID for identification for the semiconductor package based on the measured specific information and storing the thus generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor package by re-measuring the roughness as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor package ID recognition method, comprising the steps of:

• measuring a lead angle of a bonding wire provided in a semiconductor package as specific information;
• generating an ID for identification for the semiconductor package based on the measured specific information and storing the thus generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor package by re-measuring the lead angle as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor package ID recognition method, comprising the steps of:

• measuring a contour of a bonding portion provided in a semiconductor package as specific information;
• generating an ID for identification for the semiconductor package based on the measured specific information and storing the thus generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor package by re-measuring the contour of the bonding portion as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor package ID recognition method, comprising the steps of:

• measuring a shape of a bump provided in a semiconductor package as specific information;
• generating an ID for identification for the semiconductor package based on the measured specific information and storing the thus generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor package by re-measuring the shape of the bump as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor integrated circuit chip ID recognition method, comprising:

• a first step of measuring an aspect of grain boundaries of a metal film provided in a semiconductor integrated circuit chip as specific information;
• a second step of generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information and storing the generated ID for identification into a database;
• and
• a third step of acquiring again the ID for identification of the semiconductor integrated circuit chip by re-measuring the aspect of the grain boundaries as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor integrated circuit chip ID recognition method, comprising the steps of:

• measuring an edge outline of a wire provided in a semiconductor integrated circuit chip as specific information;
• generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information and storing the generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor integrated circuit chip by re-measuring the edge outline as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor integrated circuit chip ID recognition method comprising the steps of:

• measuring, as specific information, a profile of roughness or chapping generated in a side surface portion of a semiconductor integrated circuit chip in chip dicing;
• generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information and storing the generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor integrated circuit chip by re-measuring the profile of the roughness or the chapping as the specific information and comparing the re-measured specific information with data stored in the database.

A semiconductor integrated circuit chip ID recognition method, comprising the steps of:

• measuring an aspect of a reverse face of a semiconductor integrated circuit chip as specific information;
• generating an ID for identification for the semiconductor integrated circuit chip based on the measured specific information and storing the generated ID for identification into a database;
• and
• acquiring again the ID for identification of the semiconductor integrated circuit chip by re-measuring the aspect of the reverse face as the specific information and comparing the re-measured specific information with data stored in the database.