Board assembly, ink-jet and manufacturing method therefor
AssigneeBrother Kogyo Kabushiki Kaisha
InventorsKoji Imai, Yuji Shinkai
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a board assembly comprises the steps of: tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board; mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal; forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step; and bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.
Claims8
A method for manufacturing a board assembly comprising the steps of:
- tin-plating a first terminal and a copper-made second terminal that are formed on a circuit board;
- mounting an electronic component on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the electronic component and the tin-plated first terminal;
- forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step;
- and
- bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of another board by means of a thermosetting conductive adhesive.
A method for manufacturing an ink-jet head including a passage unit in which nozzles for ejecting ink and pressure chambers respectively communicating with the nozzles are formed, a piezoelectric actuator that changes a volume of any of the pressure chambers, a circuit board that is fixed to the piezoelectric actuator, and a driver IC that supplies a drive signal to the piezoelectric actuator,
- the method comprising the steps of:
- tin-plating a first terminal and a copper-made second terminal that are formed on the circuit board;
- mounting the driver IC on the circuit board by means of gold-tin eutectic bonding between a gold electrode of the driver IC and the tin-plated first terminal;
- forming a copper-tin alloy on a surface of the second terminal by heating the circuit board after the mounting step;
- and
- bonding the second terminal having the copper-tin alloy formed on its surface to a terminal of the piezoelectric actuator by means of a thermosetting conductive adhesive.
A board assembly comprising a circuit board that has a first terminal and a copper-made second terminal, an electronic component that has a gold electrode for being bonded to the first terminal and is mounted on the circuit board, and another board that has a terminal for being bonded to the second terminal, wherein:
- the first terminal, whose surface is tin-plated, is bonded to the gold electrode by means of gold-tin eutectic bonding;
- and
- the second terminal, whose surface is formed with a copper-tin alloy, is bonded to the terminal of the another board by means of a thermosetting conductive adhesive.
An ink-jet head including a passage unit in which nozzles for ejecting ink and pressure chambers respectively communicating with the nozzles are formed, a piezoelectric actuator that changes a volume of any of the pressure chambers, a circuit board that is fixed to the piezoelectric actuator, and a driver IC that supplies a drive signal to the piezoelectric actuator, wherein:
- the circuit board has a first terminal and a copper-made second terminal;
- the driver IC has a gold electrode for being bonded to the first terminal;
- the piezoelectric actuator has a terminal for being bonded to the second terminal;
- the first terminal, whose surface is tin-plated, is bonded to the gold electrode by means of gold-tin eutectic bonding;
- and
- the second terminal, whose surface is formed with a copper-tin alloy, is bonded to the terminal of the piezoelectric actuator by means of a thermosetting conductive adhesive.
Dependencies are inferred from the claim text.