Multi-processor module with redundant power
AssigneeHewlett-Packard Development Company, L.P.
InventorsSteven Belson, Shaun Harris, Eric Peterson, Gary Williams, Christian Belady, Jeffrey Christenson
Life of this patent
Estimating the term…
Abstract
One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
Claims20
1) An electronic assembly, comprising:
- a first printed circuit board (PCB);
- a second PCB having at least two processors, the second PCB being coupled to and disposed above the first PCB;
- a thermal dissipation device for dissipating heat away from the processors;
- and
- first and second power modules for providing power to the second PCB and being separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
8) A method, comprising:
- connecting first and second power systems to a first thermal dissipation device to form a power module;
- connecting plural processors and a second thermal dissipation device to a first circuit board to form a multi-processor module;
- connecting the multi-processor module and the power module to a second circuit board;
- generating redundant power to the multi-processor module from the power module such that the first power system provides sufficient power to the multi-processor module upon failure of the second power system;
- and
- dissipating heat away from both the first and second power systems with the first thermal dissipation device.
15) An electronic assembly, comprising:
- first and second printed circuit boards (PCBs) coupled in a stacked relationship, the first PCB having plural heat-generating components requiring assistance with heat dissipation;
- at least two power modules coupled to at least one of the first and second PCBs, wherein each power module supplies redundant power to the first PCB and serves as a duplicate for preventing power supply failure to the first PCB upon failure of one of the power modules;
- and
- a thermal dissipation device for dissipating heat away from the two power modules and for dissipating heat, via heat exchange, away from the plural heat-generating components.
Dependencies are inferred from the claim text.