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US 2006/0187579 A1Published application
Stress relief features for an overmolded base
AssigneeSeagate Technology LLC
InventorsMo Xu, YiRen Hong, Pohlye Lim, Niroot Jierapipatanakul
Life of this patent
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Abstract
A base assembly for use in an airtight enclosure. The base assembly includes a metal stamped section and an overmold section formed adjacent to the metal stamped section. The overmold section includes at least one stress relief feature for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
Claims20
A base assembly for use in a hermetically sealed enclosure, comprising:
- a metal stamped section;
- and
- an overmold section formed adjacent to the metal stamped section, the overmold section including at least one stress relief feature for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
A base assembly for use in a hermetically seated enclosure, comprising:
- a metal stamped section;
- an overmold section formed adjacent to the metal stamped section, the overmold section comprising:
- a plurality of mutually perpendicular sidewalls each having an inner surface, an outer surface and a first sidewall thickness;
- and
- at least one stress relief feature included in at least one of the sidewalls, the at least one stress relief feature providing a second sidewall thickness that is thinner than the first sidewall thickness.
2 more elements
A base assembly for use in a data storage system, comprising:
- a metal stamped section;
- an overmold section formed adjacent to the metal stamped section;
- and
- stress relief means included in the overmold section for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
1 more element
Dependencies are inferred from the claim text.