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US 2006/0187057 A1Published application
Radio frequency label module
OwnerSan-Lien Yanginventor
Life of this patent
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Abstract
A RadioFrequency Identification module includes a radio frequency chip, an antenna substratum and a glued substratum. The antenna substratum has an antenna positioned thereon, with the radio frequency chip attached therein. The glued substratum has a glue cavity properly bored for dispensing epoxy therein. Then the glued substratum and the antenna substratum are adhered together with adhering glue to become a RadioFrequency Identification module, which is then embedded in a carton or the like as an identifying proof describing the content of the carton.
Claims9
A Radio Frequency Identification module comprising:
- A radio frequency chip:
- An antenna substratum shaped flat and having an antenna formed on its surface of the substratum, and a radio frequency chip attached on said antenna:
- and,
- A glued substratum shaped flat and having a coating cavity formed in a proper location for epoxy to be dispensed therein, said glued substratum adhered together with said antenna substratum with adhesive glue.
1 more element
Dependencies are inferred from the claim text.