Apparatus and method for terminating probe apparatus of semiconductor wafer
AssigneeCeladon Systems, Inc.
InventorsBryan Root, William Funk
Life of this patent
Estimating the term…
Abstract
A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.
Claims9
A probe apparatus having a probe that probes a semiconductor device and terminates with a signal cable from a tester, comprising:
- a chassis;
- a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe towards the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe;
- a dielectric plate mounted in the chassis around the dielectric block, the probe extending from the proximal end of the probe to the dielectric plate towards the dielectric block and the semiconductor device at the distal end of the probe, the signal cable extending from a distal end along the dielectric plate towards the tester at a proximal end;
- and
- a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with the distal end of the signal cable side by side.
8-14. (canceled)
A method of terminating a probe that probes a semiconductor device with a signal cable from a tester, comprising the steps of:
- stripping back at least one layer of the signal cable and at least one layer of the probe;
- crimping a proximal end of the probe with a distal end of the signal cable side by side;
- and
- mounting the probe and the signal cable in a chassis, wherein a distal end of the probe is extended towards the semiconductor device, and a proximal end of the signal cable is extended towards the tester.
Dependencies are inferred from the claim text.