US 2006/0186839 A1Published application

Bonding apparatus

AssigneeKabushiki Kaisha Shinkawa

InventorsToshimichi Miyahara, Yuu To, You Kawamoto

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Abstract

A wire bonding apparatus 10 including a joining machine unit 20 for joining a wire to a subject device 4, a measurement unit 50 for measuring the connection state between the subject device 4 and the wire 24, and a control unit 40 for controlling the operation of the entire apparatus. An AC-C measurement circuit 60 of the measurement unit 50 includes an AC power supply 62, an equivalent capacitance circuit 64 that creates an essentially the same capacitance as the capacitance component of the joining machine unit 20 before bonding, a differential circuit 68 that finds the difference between the capacitance of the joining machine unit 20 after bonding and the capacitance of the equivalent capacitance circuit 64, an amplification circuit 70, a rectification circuit 72, an AID conversion circuit 74, a judgment unit 80 that judges the connection state, and an output unit 90.

Claims16

Dependent claims

A bonding apparatus comprising a stage that supports a subject device and is grounded, a joining machine unit that joins a wire to the subject device, and a measurement unit that measures a connection state between the subject device and the wire;

wherein the measurement unit comprises:
an equivalent capacitance circuit that is an equivalent circuit which compensates a capacitance component of the joining machine unit in order to measure a connection state between a wire and a subject device that has no conductance with the stage, said equivalent capacitance circuit having capacitance substantially equivalent to a machine capacitance component between the joining machine unit and the stage when the wire is not in contact with the subject device;
an alternating-current signal source that supplies an alternating-current signal to the equivalent capacitance circuit and the joining machine unit, respectively;
a capacitance comparison circuit that compares impedance of the joining machine unit when the wire is joined to the subject device and impedance of the equivalent capacitance circuit;
and
a judgment unit that judges the connection state between the wire and the subject device based on an output of the capacitance comparison circuit.

3 more elements

Dependencies are inferred from the claim text.