Semiconductor chip capable of implementing wire bonding over active circuits
AssigneeUnited Microelectronics Corp.
InventorsBing-Chang Wu, Kun-Chih Wang, Mei-Ling Chao, Shiao-Shien Chen
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Abstract
A semiconductor chip capable of implementing wire bonding over active circuits (BOAC) is provided. The semiconductor chip includes a bonding pad structure which includes a bondable metal pad, a top interconnection metal layer, a stress-buffering dielectric, and at least a first via plug between the bondable metal pad and the top interconnection metal layer. The semiconductor chip also includes at least an interconnection metal layer, at least a second via plug between the interconnection metal layer and the bonding pad structure, and an active circuit situated underneath the bonding pad structure on a semiconductor substrate.
Claims29
A semiconductor chip capable of implementing wire bonding over active circuits, comprising:
- a bondable metal pad;
- a stress-buffering dielectric positioned under the bondable metal pad for absorbing stresses produced while bonding;
- at least an inter-metal dielectric (IMD) positioned under the stress-buffering dielectric;
- an interconnection metal layer defined in the inter-metal dielectric;
- a metal frame defined in the inter-metal dielectric and electrically isolated from the interconnection metal layer for offsetting the stresses, wherein the metal frame is positioned exactly under the bondable metal pad;
- and
- an active circuit positioned under the bondable metal pad on a semiconductor substrate.
A semiconductor chip capable of implementing wire bonding over active circuits comprising:
- a bondable metal pad;
- a top interconnection metal layer positioned under the bondable metal pad;
- at least an inter-metal dielectric (IMD) positioned under the top interconnection metal layer;
- a metal frame positioned in the inter-metal dielectric layer serving as a reinforcement-supporting structure;
- and
- an active circuit formed on a semiconductor substrate.
Dependencies are inferred from the claim text.