Method and system for bonding a semiconductor chip onto a carrier using micro-pins

A method for manufacturing a bonding interface for mechanical and electrical bonding of a first electronic device containing structure to a second electronic device containing structure, comprising:

• (a) providing a membrane having a first and second planar surface, said first planar surface being parallel to said second planar surface,
• (b) bombarding said membrane with a multiplicity of particles from a radioactive source to form a multiplicity of tracks through said membrane;
• (c) exposing said bombarded membrane to at least one anisotropic etchant to enlarge the tracks formed through said membrane by said multiplicity of particles, so as to form a multiplicity of holes extending between said first and second planar surfaces of said membrane and being substantially normal thereto, said holes having a diameter of less than 1 micron and having a density in said membrane of at least 1 hole per 4 square microns;
• (d) providing electrically conductive material inside said multiplicity of holes, said conductive material forming a multiplicity of rigid electrically conductive pins;
• and
• (d) selectively removing a portion of said membrane from said first and second planar surfaces so as to reduce the thickness of said membrane and to expose a portion of each of said multiplicity of pins protruding from the surfaces of said membrane.

A method for manufacturing a bonding interface for mechanical and electrical bonding of a first electronic device containing structure to a second electronic device containing structure, comprising:

• (a) providing a layer of high purity aluminum foil having a first and second planar surface, said first planar surface being parallel to said second planar surface;
• (b) placing the first planar surface of said layer of high purity aluminum foil onto a planar surface of a conductive plate;
• (c) exposing said high purity aluminum foil to an acid solution to form anodized alumina having a multiplicity of holes extending in a normal direction from said second planar surface toward said first planar surface, said holes having a diameter of less than 1 micron and having a density in said membrane of at least 1 hole per 4 square microns;
• (d) providing electrically conductive material inside said multiplicity of holes, said conductive material forming a multiplicity of rigid electrically conductive pins;
• and
• (e) selectively removing a portion of said anodized alumina from said first and second planar surfaces so as to reduce the thickness of said alumina and to expose a portion of each of said multiplicity of pins protruding from the surfaces of said alumina.