Method to create flexible connections for integrated circuits
AssigneeInternational Business Machines Corporation
InventorsLeena Buchwalter, Russell Budd, Chirag Patel
Life of this patent
Estimating the term…
Abstract
A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.
Claims23
A semiconductor package assembly comprising a substrate and at least one integrated circuit chip mounted on said substrate, said at least one flexible interconnect forming a compliant electrical connection between said substrate and said at least one integrated circuit chip.
A method of fabricating a compliant probe substrate, comprising of a substrate and said at least one flexible interconnect forming a compliant probe lead (interconnect).
A method of forming flexible electrical interconnects for a semiconductor package assembly, comprising providing a substrate and at least one integrated circuit chip mounted on said substrate, and interposing at least one said flexible interconnect between said substrate and said at least one chip to form a compliant electrical connection between said substrate and said at least one integrated circuit chip.
Dependencies are inferred from the claim text.