Land grid array package
AssigneesSanyo Electric Co., Ltd., Sanyo Tuner Industries Co., Ltd.
InventorTakuya Suzuka
Life of this patent
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Abstract
A land grid array package has a construction in which a device-side ground electrode 6 and a substrate-side ground electrode 9, as well as device-side peripheral electrodes 7 and substrate-side peripheral electrodes 10 are soldered by eutectic solder 16. The land grid array package is characterized in that one or more gas-vent through holes 15 passing through a package substrate 3 are formed within a soldering region 18 of the device-side ground electrode 6. Thus, a land grid array package that can prevent short circuits or disconnections is provided.
Claims20
A land grid array package comprising a semiconductor device in which a device-side center electrode is formed in a substantially central region of its back side and a plurality of device-side peripheral electrodes are formed in a periphery of the device-side center electrode, and a package substrate in which a substrate-side center electrode is provided at a position corresponding to the device-side center electrode and a plurality of substrate-side peripheral electrodes are formed at positions that are in a periphery of the substrate-side center electrode and correspond to the device-side peripheral electrodes, the device-side center electrode and the device-side peripheral electrodes being soldered to the substrate-side center electrode and the substrate-side peripheral electrodes, respectively, by one or more soldered portions, the land grid array package characterized in that:
- one or more gas-vent through holes passing through the package substrate are formed within a soldering region of the substrate-side center electrode.
Dependencies are inferred from the claim text.