Delamination reduction between vias and conductive pads

A substrate, comprising:

• a dielectric layer, the dielectric layer having a dielectric surface;
• a conductive pad on the dielectric layer, the conductive pad having a first and a second conductive pad surface, the first conductive pad surface being substantially parallel to the dielectric surface and the second conductive pad surface intersecting the first surface;
• and
• a via in contact with at least a portion of the second conductive pad surface to reduce delamination between the via and the conductive pad.

A method, comprising:

• providing a substrate, the substrate includes a dielectric layer with a dielectric surface;
• forming a conductive pad on the dielectric surface, the conductive pad comprising a first and a second surface, the first surface being substantially parallel with the dielectric surface, the second surface intersecting the first surface;
• and
• forming a via in contact with the first surface and at least a portion of the second surface.

A system, comprising:

• a substrate, including:
• a dielectric layer including a dielectric surface;
• a conductive pad on the dielectric surface, the conductive pad having a first and a second surface, the first surface being parallel with the dielectric surface, the second surface intersecting the first surface;
• and
• a via in contact with the first surface and at least a portion of the second surface to reduce delamination between the via and the at least the portion of the second surface;
• an interconnection coupled to the substrate;
• and
• a mass storage coupled to the interconnection.