Semi-conductor die mount assembly
AssigneeVisteon Global Technologies, Inc.
InventorsJay Baker, Lawrence Kneisel, Prathap Reddy
Life of this patent
Estimating the term…
Abstract
A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and thermal connection. The die mount includes a first set of pads and a second set of pads. A first pad of the first set of pads is connected to a second pad of the second set of pads through a plurality of vias. The vias comprise an electrically and thermally conductive material that connect the first pad to the second pad through a substrate.
Claims20
A die mount assembly comprising:
- a semiconductor die;
- a die mount including a first and second pad, a plurality of vias, and a substrate, the first pad being attached to the semiconductor die, and the first pad being attached to the second pad through a plurality of vias, the plurality of vias comprising an electrically and thermally conductive material to dissipate heat and supply voltage to the semiconductor die.
A die mount assembly comprising:
- a semiconductor die;
- a die mount assembly including a first and second set of pads, a plurality of vias, and a substrate, each pad of the first set of pads being attached to the semiconductor die, and each pad of the first set of pads being attached to a pad of the second set of pads through at least one of the plurality of vias, the plurality of vias comprising an electrically and thermally conductive material to dissipate heat and supply voltage to the semiconductor die, wherein the substrate comprises a material having a thermally conductive and electrically insulating material.
A die mount assembly comprising:
- a light emitting diode die;
- a die mount including a first and second pad, a plurality of vias, and a substrate, the first pad being attached to the light emitting diode die, and the first pad being attached to the second pad through a plurality of vias, the plurality of vias comprising an electrically and thermally conductive material to dissipate heat and supply voltage to the light emitting diode die, wherein the substrate comprises a material having a thermally conductive and electrically insulating material.
Dependencies are inferred from the claim text.