Chip scale package with heat spreader
OwnerDavid Corisisinventor
Life of this patent
Estimating the term…
Abstract
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.
Claims13
A paddle frame strip providing a plurality of heat sinks, each heat sink connected to a surface of a semiconductor die, comprising:
- an elongate metallic strip, comprising:
- left and right rails;
- a plurality of paddle frames positioned between said left and right rails;
- wherein each said paddle frame includes a plurality of cross members joining said left and right rails, a generally centrally positioned paddle, and support bars supportably joining said paddle to said cross members and to said rails.
A strip providing a plurality of heat sinks, each heat sink connected to a semiconductor die, comprising:
- a strip, comprising:
- left and right rails;
- and
- a plurality of paddle frames positioned between the left and right rails, each paddle frame including a plurality of cross members joining said left and right rails, a generally centrally positioned paddle, and support bars supportably joining the paddle to the cross members and to the rails.
A strip of heat sinks, each heat sink connected to a semiconductor die, comprising:
- a strip, comprising:
- left and right rails;
- and
- a plurality of paddle frames positioned between the left and right rails, each paddle frame including a plurality of cross members joining said left and right rails, a generally centrally located paddle, and support bars joining the paddle to the cross members and to the rails.
Dependencies are inferred from the claim text.