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US 2006/0186529 A1Published application
Lead frame, sensor including lead frame and method of forming sensor including lead frame
AssigneeYamaha Corporation
InventorsKenichi Shirasaka, Hiroshi Saitoh
Life of this patent
Estimating the term…
Abstract
A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.
Claims23
A lead frame comprising:
- a frame body that defines an internal region, the frame body extending in a first plane and having a first line that runs across the internal region, the internal region comprising first and second sub-regions that are bounded with each other by the first line;
- a plurality of leads that extend from the frame body;
- a first stage being disposed in the first sub-region and extending in a second plane that is parallel to the first line and tilts from the first plane, and the first stage being connected to the frame body so as to be distanced from the first line;
- and
- a second stage being disposed in the second sub-region and extending in a third plane that is parallel to the first line and tilts from the first plane and the second plane, and the second stage being connected to the frame body so as to be distanced from the first line.
2 more elements
A sensor comprising:
- a frame body that defines an internal region, the frame body extending in a first plane and having a first line that runs across the internal region, the internal region comprising first and second sub-regions that are bounded with each other by the first line;
- a plurality of leads that extend from the frame body;
- a first stage being disposed in the first sub-region and extending in a second plane that is parallel to the first line and tilts from the first plane, and the first stage being connected to the frame body so as to be distanced from the first line and the plurality of leads;
- a second stage being disposed in the second sub-region and extending in a third plane that is parallel to the first line and tilts from the first plane and the second plane, and the second stage being connected to the frame body so as to be distanced from the first line and the plurality of leads;
- a first sensor chip that is supported on the first stage;
- a second sensor chip that is supported on the second stage;
- a first connector that mechanically connects the first stage to the frame body, the first connector being bent on a second line that is parallel to the first line and being distanced from the first line;
- and
- a second connector that mechanically connects the second stage to the frame body, the second connector being bent on a third line that is parallel to the first line and being distanced from the first line.
6 more elements
A lead frame structure to be used for forming a sensor, the lead frame structure comprising:
- a frame body that defines an internal region, the frame body extending in a first plane and having a first line that runs across the internal region, the internal region comprising first and second sub-regions that are bounded with each other by the first line;
- a plurality of leads that extend from the frame body;
- a first stage being disposed in the first sub-region and extending in the first plane, and the first stage being connected to the frame body so as to be distanced from the first line and the plurality of leads;
- a second stage being disposed in the second sub-region and extending in the first plane, the second stage being connected to the frame body so as to be distanced from the first line and the plurality of leads;
- a first connector that mechanically connects the first stage to the frame body, the first connector being configured to be bendable on a second line that is parallel to the first line and to be distanced from the first line, and
- a second connector that mechanically connects the second stage to the frame body, the second connector being configured to be bendable on a third line that is parallel to the first line and to be distanced from the first line.
3 more elements
A method of forming a sensor for sensing a physical quantity, the method comprising:
- preparing a lead frame comprising:
- a frame body that defines an internal region, the frame body extending in a first plane and having a first line that runs across the internal region, the internal region comprising first and second sub-regions that are bounded with each other by the first line;
- a plurality of leads that extend from the frame body;
- a first stage being disposed in the first sub-region and extending in a second plane that is parallel to the first line and tilts from the first plane, the first stage being connected to the frame body so as to be distanced from the first line;
- and
- a second stage being disposed in the second sub-region and extending in a third plane that is parallel to the first line and tilts from the first plane and the second plane, the second stage being connected to the frame body so as to be distanced from the first line;
- mounting sensor chips on the first and second stages;
- placing the lead frame in a cavity of dies;
- and
- injecting a molten resin into the cavity toward a direction that is aligned to the first line.
7 more elements
23-32. (canceled)
Dependencies are inferred from the claim text.