Electronic component with stacked semiconductor chips and method for producing the same
OwnerHorst Theuss, Michael Weberinventors
Life of this patent
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Abstract
A semiconductor component includes a first module component and a second module component stacked one on top of the other, and a spacer arranged between the two module components. The module components are electrically connected to one another and/or to a higher-level circuit carrier by connecting elements. At at least one point, the spacing between the spacer and a contact area of the lower of the two module components is kept very small or the spacer overlaps and partially covers the contact area.
Claims24
A semiconductor component, comprising:
- a first module component having a contact area on an upper surface thereof;
- a second module component stacked on top of the first component, wherein the first and second module components are electrically connected to each other and/or to a higher-level circuit carrier by connecting elements:
- and
- a spacer arranged between the first and second module components, wherein at at least one point, a spacing distance d between the spacer and the contact area is 0 μm<d<80 μm.
A semiconductor component, comprising:
- a first module component having a contact area on an upper surface thereof;
- a second module component stacked on top of the first component, wherein the first and second module components are electrically connected to each other and/or to a higher-level circuit carrier by connecting elements;
- and
- a spacer arranged between the first and second module components, wherein at at least one point, the spacer covers a portion of the contact area while leaving a partial region of the contact area free.
A method for producing a semiconductor component, comprising:
- providing a semiconductor wafer with a plurality of semiconductor chip positions and an active surface, each semiconductor chip position having an active surface with contact areas;
- applying a photo-patternable material to the active surface of the wafer;
- patterning the photo-patternable material to form a spacer on the active surface of each semiconductor chip position;
- separating the semiconductor chip positions from the wafer to provide a plurality of lower module components, each having a spacer positioned on the active surface;
- providing a plurality of upper module components, each having an active surface with contact areas;
- mounting the lower module component on a higher-level circuit carrier;
- producing electrical connections between the lower module carrier and the higher-level circuit carrier;
- mounting one of the upper module components on the spacer of each of the lower module components;
- and
- producing electrical connections between the upper module component and the higher-level circuit carrier.
A method for producing a semiconductor component, comprising:
- mounting a first module component on a carrier, the first module component having a contact area on an upper surface thereof;
- forming a spacer above the first module component, the spacer having an outer side surface;
- and
- stacking a second module component on top of the first module such that the spacer is arranged between the first and second module components,
- wherein at at least one point, a spacing distance d between the outer side surface of the spacer and the contact area is 0 μm<d<80 μm or the contact area is partially covered by the spacer.
Dependencies are inferred from the claim text.