Chip-type micro-connector and method of packaging the same
OwnerShu-Hua Hu, Kuan-Jui Huang +1inventors
InventorsShu-Hua Hu, Kuan-Jui Huang, Chin-Chang Pan
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Abstract
The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.
Claims19
A chip-type micro-connector comprising:
- a package substrate;
- a micro-connector disposed on the package structure, the micro-connector comprising:
- a connection substrate;
- a plurality of connecting wires disposed in the connection substrate;
- a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire;
- a plurality of chips coupled to one another via the contact pads and the connecting wires;
- and
- a cap layer disposed on the micro-connector and the chips, the cap layer packaging the micro-connector and the chips on the package substrate.
A method of packaging a plurality of chips comprising:
- providing a connection substrate;
- forming a plurality of connecting wires in the connection substrate, and a plurality of contact pads electrically connected to the connecting wires;
- providing a plurality of chips electrically connected to the contact pads;
- and
- utilizing a cap layer to package the connection substrate and the chips on a package substrate.
Dependencies are inferred from the claim text.