Semiconductor device and manufacturing method thereof
AssigneeFuji Electric Device Technology Co., Ltd.
InventorsSusumu Toba, Akira Morozumi, Kazuo Furihata
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Abstract
A semiconductor device includes a solder dam for restricting the flow of solder during manufacturing. The device includes a semiconductor chip bonded to a first side of a circuit board, a metal base for dissipating heat produced by the semiconductor chip, the metal base being bonded to a second side of the circuit board, and a dam material disposed on the metal base in a predetermined pattern for restricting the flow of solder used in bonding a plurality of the circuit boards to the metal base. By employing the solder dam, solderability is not impaired, device contamination can be avoided, and a highly reliable semiconductor device can be produced.
Claims20
A semiconductor device comprising:
- a circuit board;
- a semiconductor chip bonded to a first side of the circuit board;
- a metal base for dissipating heat produced by the semiconductor chip, the metal base being bonded to a second side of the circuit board;
- and
- a dam material disposed on the metal base for restricting flow of a solder used in bonding a plurality of the circuit boards to the metal base.
A method of manufacturing a semiconductor device, comprising:
- bonding a semiconductor chip to a first side of a circuit board;
- bonding a metal base for dissipating heat produced by the semiconductor chip to a second side of the circuit board;
- and
- forming a dam on the metal base by a dam material so as to restrict flow of a solder used in bonding a plurality of the circuit boards to the metal base.
A method of manufacturing a semiconductor device, comprising:
- bonding a semiconductor chip to a first side of a circuit board;
- bonding a metal base for dissipating heat produced by the semiconductor chip to a second side of the circuit board;
- and
- fitting as a dam on the metal base a carbon jig for positioning a plurality of the circuit boards thereto so as to restrict the flow of a solder used in bonding the plurality of the circuit boards to the metal base.
Dependencies are inferred from the claim text.