Module card structure
AssigneeKingpak Technology Inc.
InventorsKevin Wu, Roy Lin
Life of this patent
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Abstract
A module card structure includes a structure, a first chip, a second chip, an adhered layer, and a compound layer. The substrate has an upper surface on which a plurality of golden finger are formed, and a lower surface. The first chip is mounted on the upper surface of the substrate and is electrically connected to the golden finger by wires. The second chip is adhered to the upper surface of the substrate by adhered layer, which includes glue and filled elements, and is electrically connected to the golden finger by wires. The compound layer is encapsulated on the first chip and second chip for encapsulating the first chip and second chip.
Claims3
A module card structure, the structure comprising:
- a substrate having an upper surface on which a plurality of golden finger are formed, and a lower surface
- a first chip mounted on the upper surface of the substrate and electrically connected to the golden finger by wires
- a second chip adhered to the upper surface of the substrate by adhered layer, which includes glue and filled elements, and electrically connected to the golden finger by wires;
- and
- a compound layer encapsulated on the first chip and second chip for encapsulating the first chip and second chip.
Dependencies are inferred from the claim text.