Semiconductor device with semiconductor chip mounted in package
AssigneeKabushiki Kaisha Toshiba
InventorSatoshi Yanagisawa
Life of this patent
Estimating the term…
Abstract
A semiconductor device including a semiconductor chip having first and second principal surfaces is disclosed. The semiconductor chip includes a first electrode formed on the first principal surface and a second electrode formed on the second principal surface. A first lead frame includes a first connecting portion connected to the first electrode and a first terminal portion. A second lead frame includes a second connecting portion connected to the second electrode and a second terminal portion. The semiconductor chip is sealed by a housing. The housing is formed so as not to cover part of surfaces of the first and second connecting portions.
Claims26
A semiconductor device, comprising:
- a semiconductor chip including first and second principal surfaces, a first electrode formed on the first principal surface, and a second electrode formed on the second principal surface;
- a first conductive lead frame including a first heat sink portion connected to the first electrode and a first terminal portion in which the first heat sink portion entirely covers the first electrode and is unified with the first terminal portion;
- a second conductive lead frame including a second heat sink portion connected to the second electrode and a second terminal portion in which the second heat sink portion entirely covers the second electrode and is unified with the second terminal portion;
- and
- a housing which is provided with front, side and rear surfaces to hold the semiconductor chip and is formed not to cover part of surfaces of the first and second heat sink portions in order to expose the first and second heat sink portions from the front and rear surfaces of the housing, respectively.
2-3. (canceled)
8-11. (canceled)
(canceled)
16-17. (canceled)
A semiconductor device, comprising:
- a semiconductor chip including first and second principal surfaces, a first electrode formed on the first principal surface, and a second electrode formed on the second principal surface;
- a first conductive lead frame including a first connecting portion connected to the first electrode and a first terminal portion in which the first connecting portion is plate-shaped and the first connecting portion entirely covers the first electrode and is unified with the first terminal portion;
- a second conductive lead frame including a second connecting portion connected to the second electrode and a second terminal portion in which the second connecting portion is plate-shaped and the second connecting portion entirely covers the second electrode and is unified with the second terminal portion;
- and
- a housing having front, side and rear surfaces to seal the semiconductor chip, and being formed not to cover part of surfaces of the first and second connecting portions in order to expose the first and second connecting portions from the front and rear surfaces of the housing, respectively.
(canceled)
24-27. (canceled)
(canceled)
32-33. (canceled)
Dependencies are inferred from the claim text.