Dual row leadframe and fabrication method
AssigneeSTATS ChipPAC, Ltd.
InventorsJeffrey Punzalan, Jose Caparas, Jae Hun Ku
Life of this patent
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Abstract
A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.
Claims10
A semiconductor package comprising:
- a leadframe comprising:
- a die attach paddle;
- a number of inner leads;
- a number of outer leads;
- a number of extended lead tips on the number of outer leads to extend the inner edges of the number of outer leads in substantial alignment with the inner edges of the number of inner leads;
- a die attached to the die attach paddle
- a number of bonding wires connecting the die to the number of inner leads and the number of outer leads;
- and
- an encapsulant over the leadframe and the die.
A leadframe comprising:
- a die attach paddle;
- a number of inner leads around the periphery of the die attach paddle;
- a number of outer leads around the die attach paddle;
- a number of extended lead tips to the outer leads, wherein:
- the extended lead tips extend inwardly toward the die attach paddle;
- whereby the inner edges of the number of inner leads and the inner edges of the number of extended lead tips are substantially in alignment.
Dependencies are inferred from the claim text.