Package stacking lead frame system
AssigneeSTATS ChipPAC, Ltd.
InventorsIL Kwon Shim, Ming Ying, Seng Guan Chow
Life of this patent
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Abstract
The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected to the dual row of terminal leads, molding a molding compound around the first die and the dual row of terminal leads and mounting a second integrated circuit package on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.
Claims20
A package stacking lead frame system comprising:
- forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad;
- mounting a first die on the die attach pad, wherein the first die is connected to the dual row of terminal leads;
- molding a molding compound around the first die and the dual row of terminal leads;
- and
- mounting a second integrated circuit package on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.
A package stacking lead frame system comprising:
- forming a lead frame interposer comprises:
- providing a die attach pad in a center of the lead frame interposer;
- utilizing a dual row of terminal leads, having internal terminal leads and external terminal leads, positioned around the die attach pad;
- providing dam bars attached to the dual row of terminal leads;
- and
- forming tie bars between the dam bars and the die attach pad;
- mounting a first die on the die attach pad wherein the first die is connected to the internal terminal leads;
- molding a molding compound around the first die and the dual row of terminal leads further comprises forming a QFN-like package;
- and
- mounting a second integrated circuit package on the lead frame interposer, wherein a large second integrated circuit package is mounted over a smaller first die.
A package stacking lead frame system comprising:
- a lead frame interposer having a dual row of terminal leads positioned around a die attach pad;
- a first die mounted on the die attach pad, comprises the first die electrically connected to the dual row of terminal leads;
- a molding compound molded around the first die and the dual row of terminal leads;
- and
- a second integrated circuit package mounted on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.
The system as claimed in claim 111 further comprising solder resist regions and solder wettable areas formed by the molding compound around the dual row of terminal leads.
Dependencies are inferred from the claim text.