Solid-state imaging device and method of manufacturing said solid-state imaging device
AssigneeFUJIFILM Corporation
InventorsHiroshi Maeda, Kazuhiro Nishida, Yoshihisa Negishi, Shunichi Hosaka
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Abstract
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
Claims20
A solid-state imaging device comprising:
- a semiconductor substrate provided with an IT-CCD;
- and
- a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
- wherein the translucent member constitutes an optical member having a condensing function.
A solid-state imaging device comprising:
- a first semiconductor substrate provided with an IT-CCD;
- and
- a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
- wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate.
A solid-state imaging device comprising:
- a first semiconductor substrate provided with an IT-CCD;
- and
- a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
- wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
- the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate.
Dependencies are inferred from the claim text.