Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
AssigneeMicron Technology, Inc.
InventorsUlrich Boettiger, Jin Li, Steven Oliver
Life of this patent
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Abstract
Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
Claims30
A microelectronic imager device, comprising:
- an imaging die comprising a substrate having a front side and a backside, a microelectronic image sensor having a face located at the front side of the substrate, and integrated circuitry connected to the image sensor;
- and
- a flexor unit having a portion of a backing member that includes a shaped surface having a non-planar contour, wherein a portion of the backside of the substrate is attached to the shaped surface of the backing member such that the face of the image sensor is curved.
A microelectronic imager device assembly, comprising:
- a substrate having a front side, a backside, and a plurality of imaging dies arranged in a die pattern, wherein the imaging dies comprise microelectronic image sensors located at the front side of the substrate and integrated circuitry electrically coupled to the image sensors;
- and
- a backing member including a plurality of curved surfaces arranged in the die pattern, wherein individual curved surfaces are aligned with a corresponding image sensor and attached to the backside of the substrate.
A method of manufacturing microelectronic imager devices, comprising:
- providing a substrate having a front side, a backside and a plurality of imaging dies arranged in a die pattern, wherein the imaging dies comprise microelectronic image sensors located at the front side of the substrate and integrated circuitry electrically coupled to the image sensors;
- providing a backing member comprising a plurality of curved surfaces arranged in the die pattern;
- and
- attaching the curved surfaces to the backside of the substrate such that the curved surfaces are aligned with corresponding image sensors.
A method of manufacturing microelectronic imager devices, comprising:
- providing a substrate having a front side, a backside, and a plurality of imaging dies arranged in a die pattern, wherein the imaging dies having image sensors and integrated circuitry coupled to corresponding image sensors;
- providing a mold having a plurality of curved molding sites arranged in the die pattern;
- and
- conforming the imaging dies to the curved molding sites to bend the image sensors to a desired curvature.
Dependencies are inferred from the claim text.