Semiconductor device and method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsMasahiro Koike, Masato Koyama, Tsunehiro Ino, Yuuichi Kamimuta, Akira Takashima, Masamichi Suzuki, Akira Nishiyama
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Abstract
Disclosed is a semiconductor device comprising a substrate, an insulating film formed above the substrate and containing a metal, Si, N and O, the insulating film containing metal-N bonds larger than the sum total of metal-metal bonds and metal-Si bonds, and an electrode formed above the insulating film.
Claims12
A method for manufacturing a semiconductor device, comprising:
- forming above a substrate an insulating film comprising a metal, Si, N and O, by off-axis sputtering, the insulating film comprising more metal-N bonds than the total sum of metal-metal bonds and metal-Si bonds;
- and
- forming an electrode above the insulating film.
A method for manufacturing a semiconductor device, comprising:
- forming above a substrate a nitride film having an off-stoichiometric composition comprising metal and Si by off-axis sputtering;
- oxidizing the nitride film to form an insulating film comprising more metal-N bonds than the total sum of metal-metal bonds and metal-Si bonds;
- and
- forming an electrode above the insulating film.
A method for manufacturing a semiconductor device, comprising:
- forming above a substrate an oxide film having an off-stoichiometric composition comprising metal and Si by off-axis sputtering;
- nitriding the oxide film to form an insulating film comprising more metal-N bonds than the total sum of metal-metal bonds and metal-Si bonds;
- and
- forming an electrode above the insulating film.
A method for manufacturing a semiconductor device, comprising:
- forming above a substrate a metal silicide film having an off-stoichiometric composition comprising metal and Si by off-axis sputtering;
- oxynitriding the metal silicide film to form an insulating film comprising more metal-N bonds than the total sum of metal-metal bonds and metal-Si bonds;
- and
- forming an electrode on the insulating film.
Dependencies are inferred from the claim text.