3-Dimensional flash memory device and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSung-Min Kim, Eun-Jung Yun, Dong-Won Kim, Jae-Man Yoon
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Abstract
In an embodiment, a 3-dimensional flash memory device includes: a gate extending in a vertical direction on a semiconductor substrate; a charge storing layer surrounding the gate; a silicon layer surrounding the charge storing layer; a channel region vertically formed in the silicon layer; and source/drain regions vertically formed on both sides of the channel region in the silicon layer. Integration can be improved by storing data in a 3-dimensional manner; a 2-bit operation can be performed by providing transistors on both sides of the gate.
Claims27
A semiconductor device comprising:
- a gate extending in a substantially vertical direction on a semiconductor substrate;
- a charge storing layer surrounding the gate;
- a silicon layer surrounding the charge storing layer;
- a channel region substantially vertically formed in the silicon layer;
- and
- source/drain regions substantially vertically formed on both sides of the channel region in the silicon layer.
A method of fabricating a semiconductor device, the method comprising:
- alternately forming silicon layers doped with impurities and oxide layers on a semiconductor substrate;
- patterning the oxide layers and the silicon layers to form an oxide layer pattern and a silicon layer pattern having a contact hole to expose a region of the semiconductor substrate;
- forming a single crystalline silicon layer on a wall of the contact hole;
- forming a charge storing layer on the single crystalline silicon layer;
- forming a gate in the contact hole;
- patterning the oxide layer pattern and the silicon layer pattern to form a trench to expose the semiconductor substrate and the silicon layer pattern, thereby forming a bit line from the silicon layer pattern;
- forming a trench isolation layer to bury the trench;
- and
- forming a source and a drain region in the silicon layer pattern, the source and the drain region being isolated from each other along a vertical direction, a channel region interposed between the source and the drain regions.
A method of fabricating a semiconductor device, the method comprising:
- alternately forming silicon layers doped with impurities and silicon-germanium layers on a semiconductor substrate;
- patterning the silicon-germanium layers and the silicon layers to form a silicon-germanium layer pattern and a silicon layer pattern having a contact hole to expose the semiconductor substrate;
- forming a single crystalline silicon layer on a wall of the contact hole;
- forming a charge storing layer on the single crystalline silicon layer;
- forming a gate in the contact hole;
- patterning the silicon-germanium layer pattern and the silicon layer pattern to form a trench to expose the semiconductor substrate and the silicon layer pattern, thereby forming a bit line;
- removing the silicon-germanium pattern;
- forming a trench isolation layer to bury the trench;
- and
- forming a source region and a drain region vertically isolated from each other, a channel region interposed between the source and the drain regions.
A 3-dimensional flash memory device comprising:
- a gate extending in a substantially vertical direction on a semiconductor substrate;
- a charge storing layer surrounding the gate;
- a semiconductor layer surrounding the charge storing layer;
- channel regions symmetrically disposed on opposite sides of the gate in the semiconductor layer and isolated from one another vertically;
- and
- source/drain regions symmetrically disposed on opposite sides of the gate in the semiconductor layer and isolated from one another vertically by the channel regions interposed between the source/drain regions.
A method of fabricating a 3-dimensional flash memory device, the method comprising:
- alternately forming silicon layers having doped impurities and oxide layers on a semiconductor substrate;
- patterning the oxide layers and the silicon layers to form a trench to expose the semiconductor substrate and to form a bit line from the silicon layer;
- forming a trench isolation layer that buries the trench;
- forming a contact hole to expose the semiconductor substrate by etching the trench isolation layer;
- forming a single crystalline silicon layer on the wall of the contact hole;
- forming a charge storing layer on the single crystalline silicon layer;
- forming a gate in the contact hole;
- and
- forming source/drain regions on both sides of each of the channel regions and forming channel regions isolated from one another in a vertical direction in the silicon layer on both sides of the gate.
A semiconductor device comprising:
- a cylindrical gate that vertically extends from a semiconductor substrate;
- a charge storing layer concentrically surrounding the cylindrical gate;
- a semiconductor layer concentrically surrounding the charge storing layer;
- channel regions disposed in the semiconductor layer;
- and
- source/drain regions disposed in the semiconductor layer and isolated from one another vertically by the channel regions.
Dependencies are inferred from the claim text.