Light emitting diode package and fabrication method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHo Park, Woong Hwang, Seog Choi, Sung Lee, Sang Choi, Chang Lim
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Abstract
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
Claims19
A light emitting diode package comprising:
- a submount silicon substrate;
- an insulating film and electrode patterns formed on the insulating film on the submount silicon substrate;
- a spacer having a through hole, formed on the electrode patterns;
- an LED received in the through hole, flip-chip bonded to the electrode patterns;
- and
- a planar optical element adhered to the upper surface of the spacer.
A fabrication method of a light emitting diode package comprising steps of:
- forming an insulating film and electrode patterns on the insulating film on a submount silicon substrate;
- mounting an LED on the electrode patterns by flip-chip bonding;
- placing a spacer having a through hole on the electrode patterns to dispose the LED in the through hole;
- and
- adhering a planar optical element to the upper surface of the spacer.
A fabrication method of light emitting diode packages comprising steps of:
- forming an insulating film and a plurality of electrode patterns in their order on a silicon substrate;
- mounting a plurality of LEDs on the electrode patterns by flip-chip bonding;
- placing a spacer having a plurality of through holes on the plurality of electrode patterns to dispose each of the plurality of LEDs in each of the through holes;
- adhering a planar optical element to the upper surface of the spacer;
- and
- dicing a resultant structure with the planar optical element adhered thereto into individual LED packages.
Dependencies are inferred from the claim text.