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US 2006/0186429 A1Published application
Semiconductor light emitting device and method of manufacture
AssigneeAvago Technologies ECBU IP Pte Ltd
InventorTong Chew
Life of this patent
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Abstract
A light-emitting diode (“LED”) device has an LED chip attached to a substrate. The terminals of the LED chip are electrically coupled to leads of the LED device. Elastomeric encapsulant within a receptacle of the LED device surrounds the LED chip. A second encapsulant is disposed within an aperture of the receptacle on the elastomeric encapsulant.
Claims20
A light-emitting diode (“LED”) lamp comprising:
- a substrate;
- an LED chip having a first terminal and a second terminal attached to the substrate;
- a first lead electrically coupled to the first terminal of the LED;
- a second lead electrically coupled to the second terminal of the LED;
- a receptacle having an aperture, the LED chip and at least a portion of the substrate being inserted into the receptacle through the aperture;
- elastomeric encapsulant within the receptacle surrounding at least the LED chip;
- and
- rigid encapsulant disposed within the aperture of the receptacle on the elastomeric encapsulant.
5 more elements
A method of manufacturing a light-emitting diode (“LED”) device comprising:
- die-attaching an LED chip to a substrate;
- electrically connecting the LED chip to leads of the LED device;
- dispensing uncured elastomeric encapsulant into a receptacle of the LED device through an aperture of the receptacle;
- inserting the LED chip and substrate through the aperture so as to surround the LED chip with elastomeric encapsulant;
- and
- curing the elastomeric encapsulant.
3 more elements
Dependencies are inferred from the claim text.