Semiconductor device
OwnerTakayuki Ezakiinventor
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Abstract
When performing connection to an external substrate by heat pressure, damage to a first functional area having low resistance against an applied pressure is alleviated, and to carried out the connection with high reliability. The present invention is such that a semiconductor device has, on a substrate (10), a first functional area (1) (for example, a storage element area) and a second functional area (2) (for example, a driving circuitor signal processing circuit), wherein, if the substrate (10) is viewed in a planar fashion, a bump corresponding to an electrode for externally inputting and outputting a signal is provided in the second functional area (2) disposed inside a circumscribed rectangle of the first functional area (1).
Claims7
A semiconductor device having, on a substrate, a first functional area and a second functional area, characterized in that:
- if the substrate is viewed in a planar fashion, an electrode for externally inputting and outputting a signal is provided in the second functional area disposed inside a circumscribed rectangle of the first functional area.
Dependencies are inferred from the claim text.