Phase-shift masked zone plate array lithography
AssigneeNone recorded
InventorsHenry Smith, George Barbastathis, Rajesh Menon
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AssigneeNone recorded
InventorsHenry Smith, George Barbastathis, Rajesh Menon
Estimating the term…
A lithography system includes a source of radiation energy and a zone plate array to focus the radiation energy to create an array of images in order to produce a permanent pattern on a substrate. A phase-shift mask is optically located between the source of radiation energy and the zone plate array. The modulated wavefront produced by the phase-shift mask alters the field diffracted by the zone plate array, and the center lobe of the point-spread function narrows as a result.
A lithography system comprising:
A lithography system comprising:
A lithography system comprising:
A substrate imaged using a lithography system having a source of radiation energy;
A method of imaging a substrate using lithography, comprising:
A method of imaging a substrate using lithography, comprising:
A method of imaging a substrate using lithography, comprising:
Dependencies are inferred from the claim text.
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Mask effects on the imaging process: addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid…
Mask projection systems: multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
Mask projection systems: mask effects on the imaging process
Mask projection systems: details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or…
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The present invention is directed to lithography using an array of Fresnel zone plates. More particularly, the present invention to lithography using a combination of a phase-shift mask and an array of Fresnel zone plates.
Lithography is conventionally performed by a variety of systems and methods. Optical projection lithography employs a reticle (also called a mask) which is then imaged onto a substrate using either refractive or reflective optics, or a combination of the two. The reticle or mask contains the pattern to be created on the substrate, or a representation thereof. Often, but not always, the optics produces a reduction of the reticle image by a factor between 4 and 10. In other cases there is no reduction of magnification, often referred to as 1-to-1 imaging.
X-ray lithography employs a mask held in close proximity (e.g., a gap of zero to 50 micrometers) to the substrate. By passing x-ray radiation through the mask, the pattern on the mask is replicated in a radiation-sensitive film on the substrate. This film is commonly called a “resist.”
The present invention may take form in various components and arrangements of components, and in various steps and arrangements of steps. The drawings are only for purposes of illustrating a preferred embodiment or embodiments and are not to be construed as limiting the present invention, wherein:
FIG. 1 is a perspective view of an array of Fresnel zone plates configured on a silicon substrate in accordance with the invention;
FIG. 2 is a cross-sectional schematic view of an exemplary embodiment illustrating the focusing of incident beamlets onto a resist-coated substrate;
The present invention will be described in connection with preferred embodiments; however, it will be understood that there is no intent to limit the present invention to the embodiments described herein. On the contrary, the intent is to cover all alternatives, modifications, and equivalents as may be included within the spirit and scope of the present invention as defined by the appended claims.
For a general understanding of the present invention, reference is made to the drawings. In the drawings, like reference numbering has been used throughout to designate identical or equivalent elements. It is also noted that the various drawings illustrating the present invention may not have been drawn to scale and that certain regions may have been purposely drawn disproportionately so that the features and concepts of the present invention could be properly illustrated.
As noted above, it is desirable to provide a zone plate array lithography system that provides control of the size and phase profile of the point-spread function. To realize such a system, the present invention utilizes a phase-shift mask in conjunction with the zone plate array lithography system. In the system of the present invention, the phase-shift mask used to control the size and phase profile of the point-spread function so as to optimize the lateral shape of the point-spread function in terms of narrowness or depressed side-lobes.