Wave solder nozzle
AssigneeSpeedline Technologies, Inc.
InventorJames Morris
Life of this patent
Estimating the term…
Abstract
A wave solder nozzle is capable of delivering solder material to perform a wave soldering operation on a printed circuit board in an inert atmosphere. The wave solder nozzle includes a front plate and a back plate coupled to the front plate. The front plate and the back plate define a channel through which solder material flows. The nozzle further includes an exit trough extending from the back plate. The exit trough has a weir provided at one end of the exit trough. The exit trough is constructed and arranged to control the flow of solder material from the wave solder nozzle. A surface of the exit trough is wettable to improve the flow of solder material out of the wave solder nozzle. A method of improving the flow of solder material through the nozzle is also disclosed.
Claims15
A wave solder nozzle adapted to deliver solder material to perform a wave soldering operation on a printed circuit board in an inert atmosphere, the wave solder nozzle comprising:
- a front plate;
- a back plate coupled to the front plate, the front plate and the back plate defining a channel through which solder material flows;
- and
- an exit trough extending from the back plate, the exit trough having a weir provided at one end of the exit trough, the exit trough being constructed and arranged to control the flow of solder material from the wave solder nozzle,
- wherein a surface of the exit trough is wettable to improve the flow of solder material out of the wave solder nozzle.
A wave soldering machine to perform a wave soldering operation on a printed circuit board in an inert atmosphere, the wave soldering machine comprising:
- a housing;
- a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board to the housing;
- a wave soldering station coupled to the housing, the wave soldering station comprising
- a reservoir of solder material, and
- a wave solder nozzle in fluid communication with the reservoir, the wave solder nozzle comprising a front plate, a back plate coupled to the front plate, the front plate and the back plate defining a channel through which solder material flows, and an exit trough extending from the back plate, the exit trough having a weir provided at one end of the exit trough, the exit trough being constructed and arranged to control the flow of solder material from the wave solder nozzle, wherein a surface of the exit trough is wettable to improve the flow of solder material out of the wave solder nozzle;
- and
- a controller to control the operation of the wave soldering machine.
The wave soldering machine of claim 11, wherein the wettable surface is located on the chamfered edge.
A method of improving the flow of solder material out of a wave solder nozzle of a wave soldering machine in an inert atmosphere, the method comprising:
- delivering solder material to a wave solder nozzle;
- performing a wave soldering operation on a printed circuit board;
- and
- improving the flow of solder material over the wave solder nozzle by providing a surface of the wave solder nozzle with a wettable material.
Dependencies are inferred from the claim text.