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US 2006/0186172 A1Published application
Lead free desoldering braid
AssigneeIllinois Tool Works Inc.
InventorsGary Klein, Susan Max
Life of this patent
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Abstract
A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.).
Claims9
A braid for desoldering a printed circuit board or electrical component having a lead-free solder, comprising:
- a plurality of solid copper metal strands bundled together to form a bundle;
- a plurality of bundles braided with one another to form a braid;
- and
- a flux coating on the braid,
- wherein the braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183° C. (about 361° F.).
2 more elements
2-3. (canceled)
Dependencies are inferred from the claim text.