Method to improve the control of electro-polishing by use of a plating electrode in an electrolyte bath
AssigneeLSI Logic Corporation
InventorsMichael Berman, Steven Reder
Life of this patent
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Abstract
A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.
Claims8
A system for electro-polishing a semiconductor wafer having material thereon, said system comprising:
- a fluid path for carrying electrolyte polishing solution to the semiconductor wafer;
- and an electrode in the fluid path, said electrode configured to remove atoms from the electrolyte polishing solution.
Dependencies are inferred from the claim text.