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US 2006/0185897 A1Published application
Electronic package and packaging method
AssigneeCitizen Electronics Co., Ltd.
InventorTetsuya Koike
Life of this patent
Estimating the term…
Abstract
A first substrate includes a coil assembly and an integrated circuit mounted thereon. A second substrate includes capacitors 16 and resistors mounted thereon. The first substrate and the second substrate are interconnected by an encapsulating medium. A conductive via is provided to electrically connect the first substrate and the second substrate together
Claims11
An electronic package comprising:
- a first substrate having a front surface and a back surface,
- at least one electronic component mounted on said front surface of said first substrate,
- a second substrate having a front surface and a back surface,
- at least one electronic component mounted on said front surface of said second substrate, and
- an encapsulating layer filled between front surfaces of said first and second substrates to encapsulate said at least one electronic component on said front surface of said first substrate and said at least one electronic component on said front surface of said second substrate and interconnect said first and second substrates.
2 more elements
A method for fabricating an electronic package, comprising the steps of:
- providing a first substrate having a front and back surface and a second substrate having a front and back surface, said first substrate including at least one electronic component mounted on the front surface of said first substrate, and said second substrate including at least one electronic component mounted on the front surface of said second substrate;
- and
- forming an encapsulating layer between the front surface of said first substrate and the front surface of said second substrate, with said first and second substrates being oriented so that the front surface of said first substrate and the front surface of said second substrate face each other.
Dependencies are inferred from the claim text.