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US 2006/0185896 A1Published application
Heat sink, an electronic component package, and a method of manufacturing a heat sink
AssigneeNEC Corporation
InventorHironobu Ikeda
Life of this patent
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Abstract
A heat sink for an electronic component includes a structure that is bendable.
Claims19
A heat sink for an electronic component, comprising:
- a structure that is bendable.
A heat sink for an electronic component, comprising:
- a structure that dissipates heat;
- and
- means for allowing said structure to bend.
A method of manufacturing a heat sink, comprising:
- dividing a bottom surface of said heat sink into multiple partial regions.
Dependencies are inferred from the claim text.