Universal pattern of contact pads for semiconductor reflow interconnections

Abstract

An insulating substrate comprises an orderly and repetitive arrangement of a plurality of metal pads (320, 321) of about the same size interconnected by conductive traces (330), wherein these traces form parallel equidistant rows. The plurality of pads is divided in sub-arrays (380, 381) of equal numbers of pads. The pads in each sub-array are positioned so that the corresponding pad of each following row is located at a predetermined angle (370) relative to the corresponding pad of the preceding row, and the angle is selected for minimizing the pitch of the traces, center to center, and maximizing the pad density. Further, the respective traces of each sub-array are connected so that the pads of one sub-array are positioned as the mirror image of the pads of the adjacent sub-arrays.

Dependencies are inferred from the claim text.