Conductive contamination reliability solution for assembling substrates

A method for assembling an electrical component having a plurality of leads on a substrate having a plurality of conductive contacts, comprising:

• installing an elastomer shape cut by a punch die on said plurality of leads on said electrical component to substantially encapsulate said plurality of leads;
• pushing said plurality leads of said electrical component on said plurality of conductive contacts on said substrate substrate;
• and
• bonding said plurality of leads of said electrical component to said plurality of conductive contacts to form a plurality of electrical connections between said plurality of leads and said plurality of conductive contacts.

An assembled substrate, comprising:

• a substrate having a plurality of conductive contacts;
• an electrical component having a plurality of leads;
• an elastomer surrounding said plurality of leads on said electrical component to substantially encapsulate said plurality of leads;
• and
• a bond between a corresponding lead of said plurality of leads of said electrical component and a corresponding conductive contact of said plurality of conductive contacts to form a plurality of electrical connections between said plurality of leads and said plurality of conductive contacts.

An assembled substrate, comprising:

• a substrate having a plurality of conductive contacts;
• an electrical component having a plurality of leads;
• an elastomer that surrounds the plurality of leads on the electrical component;
• and
• a bond between a corresponding lead of the plurality of leads of the electrical component and a corresponding conductive contact of the plurality of conductive contacts to form an electrical connection between the corresponding lead and the corresponding conductive contact.