Surface-mounting type electronic circuit unit without detachment of solder
AssigneeAlps Electric Co., Ltd.
InventorShuichi Takeda
Life of this patent
Estimating the term…
Abstract
A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface thereof. Solder bumps are provided on second lands. Since the pedestal bases used as the mounting reference of the insulating substrate is formed in a plate shape and is placed on the same plane as the first lands and the mother board, the contact state between the first lands a the mother board is effectively stabilized. In addition, since the solderable amount is more than that of a conventional invention, the solder is not detached due to an impact.
Claims18
A surface-mounting type electronic circuit unit comprising:
- an insulating substrate of which wiring patterns are formed on a top surface;
- electronic components that are connected to the wiring patterns;
- a plurality of first lands that are formed on a bottom surface of the insulating substrate;
- a plurality of second lands that are connected to the wiring patterns and are formed on the bottom surface of the insulating substrate;
- pedestal bases that are soldered to the first lands;
- and
- solder bumps that are provided on the second lands,
- wherein the pedestal bases are made of plate-shaped metal material having a solder film on the outer surface thereof, and are soldered so that top surfaces of the pedestal bases are positioned on the first lands, and
- the pedestal bases are used as a mounting reference of the insulating substrate with respect to a mother board, so that bottom surfaces of the pedestal bases and the solder bumps are soldered to the mother board.
Dependencies are inferred from the claim text.