Semiconductor device with micro connecting elements and method for producing the same

A semiconductor device comprising:

• a number of micro connecting elements for the high-frequency coupling of components of the semiconductor device, the micro connecting elements configured having an at least three-layered structural form with a first layer of conducting material, a second layer of insulating material and a third layer of conducting material, and the first and third layers extending along a common center line, shielding one another against interference fields and being fixed on correspondingly adapted pairs of contact terminal areas of the components;
• and
• wherein the pairs of contact terminal areas comprise concentrically arranged pairs of disks, an inner disk being in electrical connection with the first layer and an outer disk being in electrical connection with the third layer, the concentrically arranged pair of disks going over to plane-parallel strip-form interconnects in the components of the semiconductor device.

A semiconductor device comprising:

• means for providing high-frequency coupling of components of the semiconductor device, including a number of micro connecting elements configured having an at least three-layered structural form with a first layer of conducting material, a second layer of insulating material and a third layer of conducting material, and the first and third layers extending along a common center line, shielding one another against interference fields and being fixed on correspondingly adapted pairs of contact terminal areas of the components.