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US 2006/0185891 A1Published application
Printed board
AssigneeFujitsu Limited
InventorAkiyoshi Saito
Life of this patent
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Abstract
A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of the conductor pattern forming the pad is smaller than an area determined based on the circumference of the conductor pattern that forms the pad.
Claims4
A printed board comprising:
- a connector pad consisting of a conductor pattern,
- wherein an area of the conductor pattern forming the pad is smaller than an area determined based on the circumference of the conductor pattern that forms the pad,
- wherein the connector pad is soldered to a signal electrode.
Dependencies are inferred from the claim text.