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US 2006/0185785 A1Published application
Method of manufacturing hard disc device with a printed wiring board fixed thereto
AssigneeSony Chemicals Corp.
InventorMasayuki Kumakura
Life of this patent
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Abstract
An insulating sheet is manufactured by attaching a buffer layer and a resin film using an adhesive layer that is not adhesive at a normal ambient temperature. Since there is no need to use a release liner when manufacturing the insulating sheet, there is no release of a silicone component. Accordingly, when installing a hard disk printed wiring board, the printed wiring board and electronic circuits inside the hard disk will not be damaged by the released silicone.
Claims7
A method of manufacturing a hard disc device with a printed wiring board fixed thereto, comprising:
- attaching an adhesive layer in advance to an insulating resin film to form an adhesive film, wherein the adhesive layer has adhesiveness exhibiting temperature higher than normal ambient temperature;
- winding the adhesive film up to form a roll of the adhesive film so that an exposed surface of the adhesive layer is contact with the resin film;
- unwinding the adhesive film from the roll;
- bringing the exposed surface of the adhesive layer into contact with a buffer layer having elastic attributes and heating the adhesive layer while pressing against the buffer layer, thereby attaching the resin film to the buffer layer with the adhesive layer to form an insulating sheet;
- and
- fastening the printed wiring board to a case of the hard disc device in a state that the insulating sheet is located between the printed wiring board and the case of the hard disc device.
3 more elements
Dependencies are inferred from the claim text.