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US 2006/0185784 A1Published application
Apparatus, system and method to reduce wafer warpage
OwnerAnastacio Fuentes, Reynaldo Atienza +1inventors
InventorsAnastacio Fuentes, Reynaldo Atienza, Chesalon Clavio
Life of this patent
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Abstract
Typically, the frontside of a wafer is protected by a tape during backgrinding. Electrostatic charge may accumulate on the tape during the backgrinding operation. The wafer may warp after the backgrinding operation because the thinned wafer is not sufficiently rigid to counteract the bending forces resulting from the accumulation of electrostatic charge. In order to reduce wafer warpage, ionized air may be directed onto the wafer and tape to reduce the accumulation of electrostatic charge.
Claims17
A method comprising:
- directing ionized air at a substrate to reduce substrate warpage, the ionized air reducing an accumulation of electrostatic charge.
10-27. (canceled)
A method comprising:
- reducing a thickness of a substrate;
- and
- directing ionized air onto the substrate prior to dicing of the substrate and after the thickness of the substrate is reduced by the grinder, the ionized air reducing an accumulation of electrostatic charge on the substrate to reduce substrate warpage.
Dependencies are inferred from the claim text.