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AssigneeJX Nippon Mining & Metals Corporation
InventorsAkihisa Inoue, Hisamichi Kimura, Kenichiro Sasamori, Masataka Yahagi, Atsushi Nakamura, Hideyuki Takahashi
Estimating the term…
A sintered sputtering target having a structure where the average crystallize size is 1 nm to 50 nm and preferably comprises an alloy having a three-component system or greater containing, as its primary component, at least one element selected from among Zr, Pd, Cu, Co, Fe, Ti, Mg, Sr, Y, Nb, Mo, Tc, Ru, Rh, Ag, Cd, In, Sn, Sb, Te and a rare earth metal. This target is manufactured by sintering atomized powder. Thereby provided is a high density target having an extremely fine and uniform structure manufactured with the sintering method, in place of a conventional bulk metal glass produced by the quenching of a molten metal, which has a coarse crystal structure and requires a high cost for its production.
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A sputtering target comprising:
4-13. (canceled)
A method of manufacturing a sputtering target, comprising the step of sintering a gas atomized powder to produce a sputtering target having an amorphous structure with an average crystallite size of 1 nm to 5 nm and a relative density of at least 96.4%, said powder being an alloy powder having a three or more component system containing at least one element selected from the group consisting of Zr, Pt, Pd, Fe, Co, and Cu as its primary component in an atomic ratio of 50 at % or more, and said alloy possessing the requirements of a metallic glass satisfying an atomic radius difference of 12% or more and negative heat of mixing.
Dependencies are inferred from the claim text.